Eight built-in chambers deliver 300 wafers per hour throughput

The technology node for semiconductors has reached 65 nm. In fact, work on developing mass production technology for 45 nm devices is already underway. Furthermore, demand has increased for better cleaning, in optimized processing conditions and with improved equipment specifications.
Dainippon Screen is proud to introduce a new cutting-edge 300 mm wafer cleaning system, the new Aquaspin SU-3100. It is an advanced unit that incorporates and builds on the proven technology of the Aquaspin SU-3000, a single wafer cleaning system that has become the global standard at 300 mm wafer production sites. While the new Aquaspin SU-3100 features much of the same leading edge technology as the popular SU-3000, it offers even better cleaning and productivity than the older model, and is sure to be a valuable addition to any production line.

Features

1. Eight built-in chambers and 300 wafers per hour throughput
   A new, compact design enables the SU-3100 platform to accommodate up to eight built-in process chambers. The SU-3100 also features a new high-speed wafer transfer system that enables throughput of up to 300 wafers per hour.
2. Two types of chambers for a wide range of processing, from FEOL to BEOL
   Due to the continued miniaturization of devices and increased complexity of processing, it is critical to ensure optimized, stable conditions during every cleaning process. Some critical factors, such as temperature variations, chemical solution concentrations, and chemical supply timing, can have a profound effect on particle removal performance and the cleanliness of the wafer's surface. To ensure that the SU-3100 offers optimal processing capability under the most difficult of processing conditions, Dainippon Screen has developed two types of chambers.
   • LMP(Lite Multi-Process) Chamber Specification
     A chamber designed for post-processing such as polymer removal. The chamber's simple structure is focused toward room temperature processing and post-cleaning.
   • HMP(Hybrid Multi-Process) Chamber Specification
     A full-specification chamber designed for all types of processing. The chamber is able to handle various types of chemical and is equipped with a shield plate that allows watermark-less processing. This high-efficiency, multi-purpose unit also enables both critical cleaning and high-temperature processing.

DDI (Dynamic Direct Injection) system

In the semiconductor manufacturing process, the damage that can occur to detailed circuit patterns during cleaning, and film thickness control after cleaning, are important issues. On the one hand, particle removal is essential, but on the other hand, overetching and oxide film loss can result if cleaning isn't properly regulated. It's also important to prevent silicon oxide film etching loss around source drains and sidewall spacers. If the mixture of ammonia solution and hydrogen peroxide solution isn't maintained properly during the cleaning process, it's easy to overetch the surface of the wafer.
To solve these problems, Dainippon Screen has developed the DDI (Dynamic Direct Injection) mixing system, which enables high-precision flow control. The DDI system's high-precision flow rate control makes extremely precise mixing ratio control possible. The DDI system mixes chemical solutions just before processing, which maximizes the solutions' cleaning power. Furthermore, since the DDI system is not influenced by utility pressure fluctuation, it boasts terrific repeatability. Thanks to these features, Dainippon Screen's DDI mixing system supports optimal etching rates, cleaning results, and uniformity.