SU-3000: The next generation double cleaning system

SU-3000
 
 

Features...

  1. Pentagon Concept More...
  2. Double Clean Concept More...

Anneal Batch Clean Products Products

 

Recent versatile semiconductor manufacturing lines and advanced technical nodes require higher cleaning technology than ever. Dainippon Screen flexibly supports these demands with the lineup of its wide range of cleaning tools. Dainippon Screen's cleaners include:

  • SS-3000 spin scrubber, which physically removes minute particles;
  • MP-3000 spin processor, which incorporates multiple chemical cleaning chambers;
  • SR-3000 polymer remover, which thoroughly removes residual resist polymer after dry ashing;
  • MP-3000CB, which achieves bevel cleaning in copper interconnect processes;
  • VP-C812 vapor phase cleaner, which enables highly selective etching of silicon oxides.

 By standardizing the platform of these cleaners, Dainippon Screen has developed the SU-3000 AQUASPIN double cleaning system, which supports next generation cleaning/drying processes and the mini fab concept.

Enabling the optimal cleaning matched to the surface and backside condition of each wafer, the SU-3000 realizes ultra clean processing, which has not been possible with conventional single wafer cleaners and batch cleaners.

1. Pentagon Concept
The synergy of the advanced five units

  • Several processing units (max. 4 units) can be incorporated in a single platform.
  • A combination of process units (1+3, 2+2 and others) is selectable, in order to achieve the required process tact.
  • An optional wafer reversing unit enables chemical and physical cleaning for both sides of wafers.
  • A flexible unit combination supports the new processes created by the new materials and the CD shrinkage.

2. Double Clean Concept
An ultra-clean surface processing that uses two units

  • Conventional simultaneous, double-sided cleaning by batch cleaners has often resulted in cross contamination, however, our single wafer, double-cleaning method cleans both sides of wafers without any transfer of contaminants.
  • More advanced cleaning results are available by combining the MP unit, which features a reputable FEOL processes, and the SS unit, which boasts the No.1 worldwide market share as a physical cleaner.

 

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