Featuring versatile application to polymer removal and support for Cu/Low-k processes


 
 
SR-3000

Features...

  1. Supports new chemicals  More...
  2. Chemical carry-over suppressed More...
  3. Uniform polymer removal More...
  4. Efficient chemical circulation More...
  5. Low pressure single wafer bake More...

Anneal Batch Clean Products Products

  Recent leading-edge multi-layer technology and CD shrink for semiconductor devices require far more strict removal of residual polymers than ever. In response to this, Dainippon Screen has developed the SR-3000 polymer remover which provides an optimal processing capacity to a wide range of polymers, besides supporting large 300mm wafers.

SR-3000 features a wide selection of chemicals, the most advanced polymer removal capability, optimal processing control, high cleanliness, and a flexible system configuration matched to any production capacity, enabling an ideal support for the production of next generation semiconductor devices.


1. Supports New Chemicals
There is a wide range of specifications to enable the removal of any kind of polymer. It also supports new chemicals, which are used in Cu interconnect and low-k processes. Furthermore, it can provide physical cleaning with high pressure fluid and varying sprays in addition to conventional chemical cleaning. Thus, much higher polymer removal efficiency than conventional batch chemical cleaners is available while at the same time suppressing metal corrosion and oxide etching.

2. Chemical Carry-Over Suppressed
Its single wafer processing method allows a speedy switching from chemical cleaning to DI water rinsing. As a result, it needs no intermediate rinsing, which has been necessary for conventional batch cleaners. In addition, any chemical carry-over can also be suppressed.

3. Uniform Polymer Removal
It features an easy process control and provides uniform polymer removal results at high repeatability.

4. Efficient Chemical Circulation
Its advanced chemical circulation system allows an efficient reduction of chemical use.

5. Low Pressure Single Wafer Bake
The dryer (DPH) which dehydrates wet-cleansed wafers using low-pressure single-wafer bake can be applied to the SR-3000 as an option. DPH : Depressurized Hot Plat.

 

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