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Due to recent reductions in the size of design rules, no residual polymer may be left on patterns after dry etching. Even a slight polymer residue will cause fatal defects in subsequent processes. As a result, chip manufacturers are now demanding ever more highly effective polymer removers.
In response to this, Dainippon Screen has developed the SR-2000 polymer removal system, which thoroughly removes any type of polymer using the single wafer processing method.
The SR-2000, which features a large selection of chemicals, a flexible system configuration to meet each production volume, easy process controls and highly clean processing offers an optimal solution for meeting this demand.

1. Efficient removal of any polymer
Versatile specifications to support a wide range of chemicals,
enabling efficient removal of any polymer. The combined use of
chemical and physical cleaning in single wafer processing ensures greatly upgraded
polymer removal performance ,when compared with conventional batch cleaning.
Metal corrosion and oxide etching is also suppressed.
2. Eliminates any need for an intermediate rinse
Spin processing provides a rapid switch from chemical cleaning to DI water
rinsing, and eliminates any need for an intermediate rinse.The
elimination of any chemical carryover results in a higher degree of cleanliness.
3. Easy process control
Easy process control ensures highly uniform polymer removal across the wafer.
4. Versatile chamber system
Up to four chambers can be used with a single chemical for mass
production or two pairs of chemicals can be used in two pairs of chambers
for smaller-lot
production, matching the needs and purposes of the user.
5. Chemical circulation system
The SR-2000 features a chemical circulation system that effectively reduces
chemical use.
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