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The SK-200W incorporates an all-in-one body design with higher
throughput, lower cost of ownership, and improved performance.
1. Integrated ACU
Integrated ACU for supplying temperature and humidity control
for coat modules and temperature control (humidity control optional) for develop
modules.
2. Compact Nozzle Assembly
New resist coating chambers incorporate a more compact nozzle assembly design.
3. Resist-Saving System
VPS+ coating system for the reduction of resist and chemical consumption.
4. Slit-Scan Develop System
Slit-scan develop system. A DNS unique application of the developer solution
for better CD uniformity.
5. Optimized EEW
EEW (optical Edge-Exposure Wafer) optimized for higher
throughput in DUV (248nm) applications.
6. Rapid Hot Plate
New rapid hot plate (RHP) is another DNS unique design allowing for: (1)
quick hot plate set-point changes and (2) quick wafer heating to temperature
and excellent uniformity for post-exposure bakes (PEB).
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