Compatible with a Wide Range of Low-k Materials

Features...

1. High temperature (500°) hot plates More...
2. A wide range of optional units More...
3. Low-oxygen processing/High-speed wafer cooling More...
4. Compact wafer transfer unit More...
5. Stationary cassette indexer More...
6. Established technological know-how More...

There is a growing demand for practical low-k dielectric layers and copper wiring to solve the problem of wiring delays and reduce power consumption. Conventional dielectric layers have been made primarily using plasma CVD and others. However, chip manufacturers are now demanding more effective low-k layer deposition systems for production ramps.

To meet this need, Dainippon Screen has developed the SC-W80A-AVD SOD Coater. Its spin coating method is ideal for increasing productivity and lowering running costs.

The SC-W80A-AVD is also provided with precise single wafer bake plates and a high-speed cooling unit to ensure greater process flexibility than before. The SC-W80A-AVD is therefore ready to meet the strict requirements for the next generation's processes. Moreover, inheriting the optimal system design of the well-acclaimed D-SPIN80A-Series, the SC-W80A-AVD has been greatly reduced in size.

1. High temperature (500°) hot plates
High temperature (500°) hot plates, which enable single wafer baking which has been impossible with conventional batch furnaces. As a result, in addition to increasing process flexibility, film quality and process uniformity both have been enhanced.

2. A wide range of optional units
A wide range of optional units (special environmental processes, aging, low-oxygen vertical furnaces, etc.) to support each type of low-k material. Dainippon Screen not only provides the right hardware for our users' needs, but also recommends operating conditions optimized for each type of coating material.

3. Low-oxygen processing/High-speed wafer cooling
A hot plate equipped with a low-oxygen processing function and a high-speed wafer cooling unit to prevent oxidation during high-temperature processing. These features make it possible to bake low-k materials without the problem of oxidation.

4. Compact wafer transfer unit
A compact wafer transfer unit has been incorporated to reduce the space between each processing unit. The use of multi-stage ovens also greatly reduces the overall size of the equipment.

5. Stationary cassette indexer
A stationary cassette indexer, parts passed through strict particle controls, and a mechanical transfer unit make it possible to perform highly clean wafer handling.

6. Established technological know-how
With its vast network of material manufacturers, Dainippon Screen is also working on the next two generations of low-k material coating technologies. Utilizing our established technological know-how, Danippon Screen provides the coater hardware and software to match our customers needs.

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