A Revolutionary Single Chamber Cleaning System

Features...

1. High productivity More...
2. Single chamber processing More...
3. Enhanced process performance More...
4. Reduced energy and material use More...

Along with higher clean room efficiency, 300mm wafer applicability and shrinking design rules, today's semiconductor industry requiring ever more compact and high-precision cleaners. Optimization for 0.1µm and later CD generations demands cleaning equipment that incorporates new concepts, to ensure precise and reliable processing.

The MP-3000 Spin Processor answers these demands by featuring a single chamber processing system. Wafer cleaning with several chemicals, rinsing and drying can now be accomplished in a single chamber, facilitating dry-in/dry-out processing.

Moreover, high throughput is ensured by incorporating four process chambers. The MP-3000 supports a variety of cleaning processes including pre-process cleaning, oxide etching and post-process cleaning, and is ideal for small volume production of next generation devices.

1. High productivity
The standard specifications include four chambers, each capable of a series of processes, ensuring greatly increased throughput. In addition, although being 300mm applicable, the size is equivalent to that of a 200mm wafer cleaner.

2. Single chamber processing
A new cup design enables a series of processes, including chemical cleaning, DI water rinsing and wafer drying, to be performed within a single chamber. The MP-3000 thus eliminates the risk of wafer contamination from atmospheres while increasing productivity.

3. Enhanced process performance
Optimized airflow inside the chamber effectively prevents mists from adhering to wafer surfaces. In addition, N2 purging from both sides of a wafer enables smooth local atmosphere replacement, resulting in greatly reduced drying time and increased processing capacity.

4. Reduced energy and material use
A new chemical supply and collection system together with an optimized chemical dispensing mechanism greatly reduce chemical and DI water use. In addition, strict airflow control inside the chamber and cup prevents mist and vapor turbulence, while a newly designed exhaust system eliminates the escape of chemical atmospheres, reducing the total exhaust.

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