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The technology node for semiconductor devices has
entered the 90 nm generation, with 65 nm just around the corner and 45 nm under
development. Cleaning processes are also evolving as chip manufacturers demand
the best processes and hardware for each stage.
Taking aim at the FEOL cleaning process, where even a slight variance in wafer
surface conditions can greatly affect device characteristics, Dainippon Screen
has introduced the new F-WET FC-3100 Wet Station for 300 mm wafers.
Its predecessor, the FC-3000, was quickly adopted by 300 mm plants around the
world, and today it is the global standard in wet stations. The FC-3100 takes
the advanced technologies of the FC-3000 one step further to achieve a new
standard in particle removal.
Significantly boosting semiconductor yield, it prevents cross contamination,
water marks and metal contamination, while lessening damage due to cleaning,
oxide film loss and film growth for a truly impressive level of performance.
1. Stable and Highly Reliable
7 independent modules can be easily
configured to best suit your production needs. Each module is of
standardized construction.
Dual cleaning baths are built into a single compact module for smoother
assembly, adjustment, testing and installation.
The wafer transfer robot (WTR) and horizontal transfer robot (HTR) have a new,
highly rigid and low vibration construction that minimizes particle generation.
This higher stability transfer system is a key point in improving line
reliability.
2. Quick Delivery and Start-up
Chip manufacturers can now rapidly respond
to changing market demand.
The FC-3100's standardized modular design ensures quick delivery and startup, as
well as easy modification to meet evolving needs.
The proprietary scheduler software developed by Dainippon Screen automatically
computes the best production schedule, even when multiple recipes are used
simultaneously or when chemicals need to be exchanged or replenished. It
instantly identifies which bath is available, determines where wafers should be
supplied, and calculates how much time is required. Preventing over-processing
caused by time errors, it provides a more accurate and product-tailored schedule
for high-end processes.
3. High Throughput
The FC-3100 achieves a throughput of
over 460 wafers per hour.
Impressive productivity has been realized by the addition of more load ports, a
high throughput buffer module, and a transfer robot twice as fast as previous
models.
Up to 16 FOUP can be loaded into the high throughput buffer module. Parallel
processing enables faster wafer transfer. Options that further shorten
processing time include a larger piping system that delivers DI water at the
high flow rate of 60l/min.
4. Support for Smaller Design Rules
Advanced technologies support a 65 nm node.
SCC (Single Chamber Cleaning) System (option)
For smaller design rules, wafer surface cleanliness is often affected when the
wafer is transferred to the drying process through the vapor-liquid boundary.
The SCC system solves this problem by handling all processes within a single
chamber, from chemical processing to rinsing and drying.
Enabling dry-in, dry-out wafer transfer, the SCC system eliminates contact with
the atmosphere while the wafer is wet, reducing native oxide film formation for
an ultraclean silicon surface.
5. Marangoni and Low Pressure Drying (option)
The FC-3100 makes Marangoni drying possible by lowering the IPA
supply concentration used for conventional low pressure drying, enabling wafers
to be dried and cleaned without damaging the resist.
6. Phosphoric Acid Concentration
Feedback System
Oxide etching is essential to semiconductor production. In order
to improve the stability of the phosphoric acid used in this process, we
developed a chemical control system that measures and feeds back the specific
gravity of the liquid chemical, and then applies PID control to regulate its
concentration. The phosphoric acid is kept highly stable at all times to obtain
the best results for etching rate and uniformity, as well as for selective
etching of nitride and oxide films.
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