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FC-3000 is the leading-edge single bath wet station for the next generation 300 mm wafer cleaning. The FC-3000 is a combination of our best cleaning technologies taken from our WS-620/820 multi-bath wet station series and the ultra clean processing capability of our F-WET single bath wet station series. This powerful combination of technologies allows you to obtain the optimal cleaning results with both concentrated and dilute chemistries in a smaller, fixed footprint design.
The smaller, fixed footprint design also reduces cost-of-ownership (COO) by improving utilization of expensive cleanroom space. The operator interface is an easy to use Graphical User Interface running on a Windows NT operating system. Our unique wafer transfer hardware and software enables stable, high precision handling of large, heavy 300 mm wafer loads of up to 50 wafers per batch.
The FC-3000 is provided with a built-in buffer unit and it is well suited for use in a highly automated mini environment installation. The FC-3000 has built in tools such as the schedule optimization function which allows you to easily monitor equipment productivity indices such as throughput rate and Cost-of-Ownership information such as chemical/DI water consumption, enabling low C.O.O. and stable processing.
1. Low Cost-of-Ownership
Processing baths have been reduced in size by reducing the wafer pitch. Therefore, chemical and DI water consumption has also been greatly reduced.
2. High productivity
The FC-3000 can freely and continuously configure chemical circulating baths up to and including 6 bath units, relevant to the user's needs. Therefore, even when using concentrated chemicals which require long process times, for example H2SO4(SPM) or H3PO4, high throughput cleaning is attained.
3. Single bath cleaning
A series of cleaning processes using dilute HF and RCA chemistries can be performed in a single bath (ONB). Since wafers are not exposed to the air during cleaning, they are effectively protected against native oxide growth and particle contamination. Particle contamination is reduced by minimizing wafer handling/transfers and exposure of highly reactive silicon surfaces to air.
4. A wide range of applications
Each ONB style bath can use five kinds of chemicals in each process bath. The chemicals can be selected in any order by recipe control to accomplish a wide range of cleaning processes in a single bath. In addition, since the baths have been greatly reduced in number, the footprint of FC-3000 is far smaller than conventional multi-bath wet stations.
5. Watermark-free drying
The FC-3000 can also utilize our low pressure dryer technology (LPD) to eliminate watermark generation, minimize oxide growth, eliminate organic contamination and achieve ultra clean and dry surfaces.
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