A Compact Cleaner with High Throughput

Features...

1. Wet Loader More...
2. Contact and D-Sonic Cleaning More...
3. High Throughput More...
4. Reduced Footprint More...
5. Inline Congiguration Available More...
6. Flexibility More...

The new post-CMP cleaner answers the ever increasing requirements for higher productivity. By reducing wafer transfer and drying time, throughput is improved by 50%. Footprint is also reduced by optimally arranging each processing unit. Moreover, inline configuration with chemical mechanical polisher is also possible.

1. Wet Loader
The wet loader prevents wafer dehydration, enabling effective removal of slurries and other particles left on wafers after CMP.

2. Contact and D-Sonic Cleaning
After cleaning both sides of a wafer with a disk brush, the wafer surface is precisely cleaned with our unique horizontally rotating brush. D-Sonic cleaning with 1.5MHZ ultrasonic DI water is also available.

3. High Throughput
Productivity is improved. Now, It can process 60 or more wafers per hour.

4. Reduced Footprint
Footprint is reduced by 25% in comparison with our conventional model.

5. Inline Configuration Option
Inline configuration with chemical mechanical polisher is available.

6. Flexibility
Can be applied to both post-oxide-CMP cleaning and post-metal-CMP cleaning.

Return to top