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Next-Generation Scrubber SS-3100

8 built-in chambers deliver 300 WPH throughput.

Next-Generation Scrubber SS-3100

As the semiconductor technology node advances from 65 nm to 45 nm, new higher efficiency technology that can handle increasingly detailed processing becomes ever more important. At the same time, the need for cleaning technology that can support higher productivity and better yields also continues to increase.
To meet the changing needs of the market, Dainippon Screen has created the new SS-3100 Scrubber, a unit designed to address many of the issues that are expected to arise as the industry moves to the 45 nm node.
The SS-3100 is the successor to the SS-3000, a model in wide use throughout the industry, which has gained a reputation for reliability and superior operating ratios. While retaining the terrific technology and know-how of the SS-3000, the SS-3100 also offers enhanced productivity, processing efficiency, and expandability.

Features

High Throughput

8 chambers and a new transport system

The SS-3100 features 8 chambers and a new transport system that enable productivity 70 percent higher than that of the previous model - a superior throughput of up to 300 wafers per hour.

Space Savings

Stacked chamber design

The SS-3100 features a space saving, stacked chamber design. Thanks to this design, the 8-chamber SS-3100 takes up the same amount of space as the previous model with 4 chambers.

Easier Maintenance

Simple construction using CELL design

The SS-3100 uses futuristic CELL modules. All the chambers within the CELL can be pulled out, making maintenance much easier.

Improved Processing Efficiency

A wide range of cleaning tools for a variety of uses

The SS-3100 can be customized for a wide range of cleaning tasks, using a combination of tools such as the new bevel brush and the Nanospray 2, as well as traditional brushes, the Softspray, the Nanospray, and the D-Sonic cleaner.

Nanospray2

The Nanospray 2 sprays extremely fine liquid drops onto the surface of the wafer under optimal conditions, minimizing the problem - which has plagued advanced-generation processes in the past - of damage during the cleaning of wafers with ultra-fine patterns. The Nanospray 2's gentler cleaning contributes significantly to higher yields in the production of next-generation semiconductor devices.

Bevel brush

Minimizes spoiled lots caused by contamination on the bevel areas and contributes to the processes that greatly affect yield improvement in semiconductor devices, such as cleaning before batch processing

Expandability

Flexible design and chamber use

Users can select the number of chambers to be mounted on each CELL, to suit the number of wafers being processed. Up to 6 loading ports can be installed (3 loading ports are standard).

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